ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
| Шығарылым | Атауы | Файл | |
| Том 52, № 5 (2023) | The Influence of Small F2, H2, and HF Additives on the Concentration of Active Particles in Tetrafluoromethane Plasma |
 (Rus) |
|
| Efremov A., Smirnov S., Betelin V. | |||
| Том 52, № 4 (2023) | Concentration of Fluorine Atoms and Kinetics of Reactive-Ion Etching of Silicon in CF4 + O2, CHF3 + O2, and C4F8 + O2 Mixtures |
(Rus) |
|
| Efremov A., Bobylev A., Kwon K. | |||
| Нәтижелер 2 - 1/2 | |||